Thomas Bemmerl

6 Patents

• US123946972025

  Method for Fabricating a Semiconductor Device Package Comprising a Pin in the Form of a Drilling Screw

  Infineon Technologies Austria AG

  0 cites
• US123344052025

  Electronic Devices Including Vent Openings and Associated Methods

  Infineon Technologies AG

  0 cites
• US119554152024

  Semiconductor Device Package Comprising a Pin in the Form of a Drilling Screw

  Infineon Technologies Austria AG

  0 cites
• US118698302024

  Semiconductor Package and Clip with a Die Attach

  Infineon Technologies AG

  0 cites
• US118698652024

  Semiconductor Device Having a Contact Clip with a Contact Region Having a Convex Shape and Method for Fabricating Thereof

  Infineon Technologies AG

  0 cites
• US118625822024

  Package with Elevated Lead and Structure Extending Vertically from Encapsulant Bottom

  Infineon Technologies AG

  0 cites