Thomas Anand Ponnuswamy

3 Patents

• US124244532025

  Low Temperature Direct Copper-copper Bonding

  Lam Research Corporation

  0 cites
• US123920472025

  Byproduct Removal from Electroplating Solutions

  Lam Research Corporation

  0 cites
• US123053072025

  TSV Process Window and Fill Performance Enhancement by Long Pulsing and Ramping

  Lam Research Corporation

  0 cites