Thiagarajan Raman

4 Patents

• US125820012026

  Methods for Fusion Bonding Semiconductor Devices to Temporary Carrier Wafers with Cavity Regions for Reduced Bond Strength, and Semiconductor Device Assemblies Formed by the Same

  Micron Technology, Inc.

  0 cites
• US123006472025

  Apparatus Including Integrated Pads and Methods of Manufacturing the Same

  Micron Technology, Inc.

  0 cites
• US118240252023

  Apparatus Including Integrated Pads and Methods of Manufacturing the Same

  Micron Technology, Inc.

  0 cites
• US116769322023

  Semiconductor Interconnect Structures with Narrowed Portions, and Associated Systems and Methods

  Micron Technology, Inc.

  0 cites