Patents/Inventors

Thai Kee Gan

MelakaMY5 patents

6 Patents

US122058742025
Semiconductor Package with Wire Bond Joints
Infineon Technologies AG
0 cites
US120682132024
Chip Package and Semiconductor Arrangement Having Thermally Conductive Material in Contact with a Semiconductor Chip and Methods of Forming Thereof
Infineon Technologies AG
0 cites
US120573762024
Three Level Interconnect Clip
Infineon Technologies AG
0 cites
US119843922024
Semiconductor Package Having a Chip Carrier with a Pad Offset Feature
Infineon Technologies AG
0 cites
US118429532023
Semiconductor Package with Wire Bond Joints and Related Methods of Manufacturing
Infineon Technologies AG
0 cites
US116520782023
High Voltage Semiconductor Package with Pin Fit Leads
Infineon Technologies AG
0 cites