Patents/Inventors

Tetsuya Oyamada

TokyoJP12 patents

12 Patents

US125819822026
Bonding Wire for Semiconductor Devices
NIPPON STEEL Chemical & Material Co., Ltd.
0 cites
US125327672026
Al Bonding Wire
NIPPON STEEL CHEMICAL & MATERIAL CO., Ltd.
0 cites
US124631712025
Copper Bonding Wire for Semiconductor Devices and Semiconductor Device
NIPPON STEEL Chemical & Material Co., Ltd.
0 cites
US124631722025
AG Alloy Bonding Wire for Semiconductor Devices and Semiconductor Device
NIPPON STEEL Chemical & Material Co., Ltd.
0 cites
US124128642025
Bonding Wire for Semiconductor Devices
NIPPON STEEL Chemical & Material Co., Ltd.
0 cites
US123880442025
Al Bonding Wire
NIPPON STEEL Chemical & Material Co., Ltd.
0 cites
US123344672025
Copper Bonding Wire
NIPPON STEEL Chemical & Material Co., Ltd.
0 cites
US123259012025
AI Wiring Material
NIPPON STEEL Chemical & Material Co., Ltd.
0 cites
US121660062024
Bonding Wire for Semiconductor Devices
NIPPON MICROMETAL CORPORATION
0 cites
US121320252024
Bonding Wire
NIPPON STEEL Chemical & Material Co., Ltd.
0 cites
US120905782024
Al Bonding Wire
NIPPON STEEL Chemical & Material Co., Ltd.
0 cites
US116129662023
Ag Alloy Bonding Wire for Semiconductor Device
NIPPON MICROMETAL CORPORATION
0 cites