7 Patents
- US119054122024Resin Composition, Prepreg, Laminate, Multilayer Printed Wiring Board, and Semiconductor Package
RESONAC CORPORATION
0 cites - 0 cites
- 0 cites
- US116597672023Package with Built-in Thermoelectric Element
FERROTEC MATERIAL TECHNOLOGIES CORPORATION
0 cites - 0 cites
- 0 cites
- US115552382023Producing Method for Gold Sputtering Target and Producing Method for Gold Film
TANAKA KIKINZOKU KOGYO K. K.
0 cites