Patents/Inventors

Tetsuro Nishimura

OsakaJP3 patents

4 Patents

US123775012025
Solder Preform Containing Cu—co Particles
NIHON SUPERIOR CO., Ltd.
0 cites
US121722422024
Lead-free Solder Alloy
Nihon Superior Co., Ltd.
0 cites
US119809742024
Solder Joint Part and Method for Manufacturing the Same
The University Of Queensland
0 cites
US118399372023
Lead-free Solder Alloy and Solder Joint Part
NIHON SUPERIOR CO., Ltd.
0 cites