Patents/Inventors

Tetsuro Iwakura

TokyoJP1 patent

2 Patents

US124669462025
Method for Producing FRP Precursor
RESONAC CORPORATION
0 cites
US119054122024
Resin Composition, Prepreg, Laminate, Multilayer Printed Wiring Board, and Semiconductor Package
RESONAC CORPORATION
0 cites