Patents/Inventors

Teruo Haibara

SaitamaJP9 patents

9 Patents

US125327672026
Al Bonding Wire
NIPPON STEEL CHEMICAL & MATERIAL CO., Ltd.
0 cites
US124631722025
AG Alloy Bonding Wire for Semiconductor Devices and Semiconductor Device
NIPPON STEEL Chemical & Material Co., Ltd.
0 cites
US124128642025
Bonding Wire for Semiconductor Devices
NIPPON STEEL Chemical & Material Co., Ltd.
0 cites
US123880442025
Al Bonding Wire
NIPPON STEEL Chemical & Material Co., Ltd.
0 cites
US123006582025
Copper Alloy Bonding Wire for Semiconductor Devices
NIPPON STEEL CHEMICAL & MATERIAL CO., Ltd.
0 cites
US121320252024
Bonding Wire
NIPPON STEEL Chemical & Material Co., Ltd.
0 cites
US120905782024
Al Bonding Wire
NIPPON STEEL Chemical & Material Co., Ltd.
0 cites
US119293432024
Bonding Wire for Semiconductor Devices
NIPPON MICROMETAL CORPORATION
0 cites
US117216602023
Bonding Wire for Semiconductor Devices
NIPPON MICROMETAL CORPORATION
0 cites