4 Patents
- US120648452024Formulations for Chemical Mechanical Polishing Pads with High Planarization Efficiency and CMP Pads Made Therewith
Rohm And Haas Electronic Materials CMP Holdings, Inc.
0 cites - US120648462024Formulations for High Porosity Chemical Mechanical Polishing Pads with High Hardness and CMP Pads Made Therewith
Rohm And Haas Electronic Materials CMP Holdings, Inc.
0 cites - US118137132023Chemical Mechanical Polishing Pad and Polishing Method
Rohm And Haas Electronic Materials CMP Holdings, Inc.
0 cites - US118068302023Formulations for Chemical Mechanical Polishing Pads and CMP Pads Made Therewith
Rohm And Haas Electronic Materials CMP Holdings, Inc.
0 cites