Patents/Inventors

Teong Guan Yew

Pulau PinangMY3 patents

3 Patents

US124127842025
Recessed Vertical Interconnects for Device Miniaturization
Intel Corporation
0 cites
US118056022023
Chip Assemblies
Intel Corporation
0 cites
US115629592023
Embedded Dual-sided Interconnect Bridges for Integrated-circuit Packages
Intel Corporation
0 cites