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Inventors
Teng Hock Kuah
Singapore
SG
7 patents
5 Patents
US12599022
2026
Apparatus for Applying a Sintering Force via a Compressible Film
ASMPT SINGAPORE PTE. Ltd.
0 cites
US11955347
2024
Encapsulation Process for Double-sided Cooled Packages
ASMPT SINGAPORE PTE. Ltd.
0 cites
US11676937
2023
Flexible Sinter Tool for Bonding Semiconductor Devices
ASMPT SINGAPORE PTE. Ltd.
0 cites
US11621181
2023
Dual-sided Molding for Encapsulating Electronic Devices
ASMPT SINGAPORE PTE. Ltd.
0 cites
US11548273
2023
Apparatus and Method for Removing a Film from a Surface
ASMPT SINGAPORE PTE. Ltd.
0 cites