Patents/Inventors

Telesphor Kamgaing

Chandler, AZUS87 patents

63 Patents

US126219372026
Package Substrate Including Core with Trench Vias and Planes
Intel Corporation
0 cites
US126222872026
Multilayer Glass Substrate
Intel Corporation
0 cites
US126046702026
In-package Magnetic Switching Using Glass Core Technology
Intel Corporation
0 cites
US126047362026
Shield to Reduce Substrate Electromagnetic Interference and Warpage
Intel Corporation
0 cites
US125989972026
Inductor with Integrated Magnetics
Intel Corporation
0 cites
US125819722026
Electrically Conductive Strips on a Side of a Memory Module
Intel Corporation
0 cites
US125737442026
Wideband Antennas in Glass Through Direct via Feeding and Glass Stacking
Intel Corporation
0 cites
US125688582026
Secondary Die with a Ground Plane for Strip Line Routing
Intel Corporation
0 cites
US125572112026
Package Having Thick Glass Core with High Aspect Ratio Vias
Intel Corporation
0 cites
US125562162026
Distributed Radiohead System
INTEL CORPORATION
0 cites
US125423582026
Microelectronic Devices Designed with Mold Patterning to Create Package-level Components for High Frequency Communication Systems
Intel Corporation
0 cites
US125123962025
Flexible Die to Floor Planning with Bump Pitch Scale Through Glass Core via Pitch
Intel Corporation
0 cites
US124891892025
Contactless Communication Using a Waveguide Extending Through a Substrate Core
Intel Corporation
0 cites
US124446192025
Physical Vapor Deposition Seeding for High Aspect Ratio Vias in Glass Core Technology
Intel Corporation
0 cites
US124247192025
Compact Surface Transmission Line Waveguides with Vertical Ground Planes
Intel Corporation
0 cites
US124247162025
RF Filters and Multiplexers Manufactured in the Core of a Package Substrate Using Glass Core Technology
Intel Corporation
0 cites
US124128352025
Back-side Power Delivery with Glass Support at the Front
Intel Corporation
0 cites
US124009342025
Dielectric Film Coating for Through Glass Vias and Plane Surface Roughness Mitigation
Intel Corporation
0 cites
US123680912025
Package Substrate with Glass Core Having Vertical Power Planes for Improved Power Delivery
Intel Corporation
0 cites
US123622972025
Semiconductor Packages with Antennas
Intel Corporation
0 cites
US123477882025
Glass Substrates Having Signal Shielding for Use with Semiconductor Packages and Related Methods
Intel Corporation
0 cites
US123477612025
Magnetic Planar Spiral and High Aspect Ratio Inductors for Power Delivery in the Glass-core of a Package Substrate
Intel Corporation
0 cites
US123277942025
Die Coupling Using a Substrate with a Glass Core
Intel Corporation
0 cites
US122610972025
Thermal Management in Integrated Circuit Packages
Intel Corporation
0 cites
US122551582025
Components for Millimeter-wave Communication
Intel Corporation
0 cites
US122059082025
Die to Die High-speed Communication Without Discrete Amplifiers Between a Mixer and Transmission Line
Intel Corporation
0 cites
US121839612024
Methods for Conductively Coating Millimeter Waveguides
Intel Corporation
0 cites
US121662612024
Components for Millimeter-wave Communication
Intel Corporation
0 cites
US121659942024
Radio Frequency Antennas and Waveguides for Communication Between Integrated Circuit Devices
Intel Corporation
0 cites
US121551332024
Microelectronic Devices Designed with Mold Patterning to Create Package-level Components for High Frequency Communication Systems
Intel Corporation
0 cites
US121553722024
Multi-filter Die
Intel Corporation
0 cites
US121502712024
Platforms Including Microelectronic Packages Therein Coupled to a Chassis, Where Waveguides Couple the Microelectronic Packages to Each Other and Usable in a Computing Device
Intel Corporation
0 cites
US121260682024
Millimeter-wave Dielectric Waveguide Bundle Including First and Second Adjacent Dielectric Waveguides Having Different Core And/or Cladding Materials
Intel Corporation
0 cites
US121260672024
Millimeter-wave Dielectric Waveguide Including an Opening of Varying Cross-section Enclosed Within a First Material and the First Material Surrounded by a Second Material
Intel Corporation
0 cites
US121073142024
Microelectronic Support for Millimeter-wave Communication Including a Transmission Line Trace and via Pad Spaced Apart from a Respective Anti-trace and Anti-pad
Intel Corporation
0 cites
US120883602024
Dispersive Waveguide Crosstalk Mitigation
Intel Corporation
0 cites
US120407762024
Integrated Radio Frequency (RF) Front-end Module (FEM)
Intel Corporation
0 cites
US120212892024
Components for Millimeter-wave Communication
Intel Corporation
0 cites
US120071702024
Thermal Management in Integrated Circuit Packages
Intel Corporation
0 cites
US120027452024
High Performance Integrated RF Passives Using Dual Lithography Process
Intel Corporation
0 cites
US119556842024
Components for Millimeter-wave Communication
Intel Corporation
0 cites
US119166042024
Dispersion Compensation for Electromagnetic Waveguides
Intel Corporation
0 cites
US118943242024
In-package RF Waveguides as High Bandwidth Chip-to-chip Interconnects and Methods for Using the Same
Intel Corporation
0 cites
US118879462024
Semiconductor Packages with Antennas
Intel Corporation
0 cites
US118308312023
Semiconductor Package Including a Modular Side Radiating Waveguide Launcher
Intel Corporation
0 cites
US118307872023
Thermal Management in Integrated Circuit Packages
Intel Corporation
0 cites
US117841082023
Thermal Management in Integrated Circuit Packages
Intel Corporation
0 cites
US117644522023
Integrated Circuit Including a Dielectric Waveguide with a Cavity Therein Surrounded by a Conductive Coating Forming a Wall for the Cavity
Intel Corporation
0 cites
US117371542023
Patch on Interposer Package with Wireless Communication Interface
Intel Corporation
0 cites
US117282902023
Waveguide Fan-out
Intel Corporation
0 cites
US117168262023
Platforms Including Microelectronic Packages Therein Coupled to a Chassis, Where Waveguides Couple the Microelectronic Packages to Each Other and Usable in a Computing Device
Intel Corporation
0 cites
US117156932023
Dielectric Waveguide Channel for Interconnecting Dies in a Semiconductor Package Usable in a Computing Device and Method of Manufacture
Intel Corporation
0 cites
US116949622023
Microelectronic Package with Mold-integrated Components
Intel Corporation
0 cites
US116886602023
Bridge for Radio Frequency (RF) Multi-chip Modules
Intel Corporation
0 cites
US116584182023
Microelectronic Devices Designed with Mold Patterning to Create Package-level Components for High Frequency Communication Systems
Intel Corporation
0 cites
US116520572023
Disaggregated Die Interconnection with On-silicon Cavity Bridge
Intel Corporation
0 cites
US116417112023
Microelectronic Package with Substrate-integrated Components
Intel Corporation
0 cites
US116211922023
Inorganic Dies with Organic Interconnect Layers and Related Structures
Intel Corporation
0 cites
US116056032023
Microelectronic Package with Radio Frequency (RF) Chiplet
Intel Corporation
0 cites
US115948012023
Mmwave Dielectric Waveguide Interconnect Topology for Automotive Applications
Intel Corporation
0 cites
US115812722023
Contactless High-frequency Interconnect
Intel Corporation
0 cites
US115757492023
Low-weight Single Mm-wave Dielectric Waveguide Interconnect Architecture in Autonomous Cars
Intel Corporation
0 cites
US115629712023
Semiconductor Packages with Antennas
Intel Corporation
0 cites