Teck Sim Lee

6 Patents

• US120947932024

  Package with Electrically Insulated Carrier and at Least One Step on Encapsulant

  Infineon Technologies AG

  0 cites
• US119423832024

  Linear Spacer for Spacing a Carrier of a Package

  Infineon Technologies AG

  0 cites
• US118760282024

  Package with Electrically Insulated Carrier and at Least One Step on Encapsulant

  Infineon Technologies AG

  0 cites
• US118044242023

  Method for Fabricating a Semiconductor Device by Using Different Connection Methods for the Semiconductor Die and the Clip

  Infineon Technologies Austria AG

  0 cites
• US116768812023

  Semiconductor Package, Semiconductor Assembly and Method for Fabricating a Semiconductor Package

  Infineon Technologies AG

  0 cites
• US116005472023

  Semiconductor Package with Expanded Heat Spreader

  Infineon Technologies Austria AG

  0 cites