Patents/Inventors

Techi Wong

Zhubei CityTW26 patents

26 Patents

US125640762026
Chip Package with Fan-out Feature and Method for Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US125327712026
Package Structure with Fan-out Feature
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US124761982025
Package Structure with Adhesive Element Over Semiconductor Chip
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US123083132025
Semiconductor Package with Improved Interposer Structure
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US123083222025
Dual-sided Routing in 3D Semiconductor System-in-package Structure and Methods of Forming the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US123005922025
Fan-out Package with Controllable Standoff
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US122372622025
Semiconductor Package with Improved Interposer Structure
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US121990842025
Fan-out Package with Cavity Substrate
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US121763372024
Semiconductor Devices and Methods of Manufacturing
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites
US121702742024
Semiconductor Packages and Methods of Forming Same
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites
US121319842024
Heterogeneous Fan-out Structure and Method of Manufacture
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US121006662024
Method for Forming Chip Package Structure
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US120948192024
Method for Forming Package Structure
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US120741042024
Integrated Circuit Packages with Ring-shaped Substrates
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US120465482024
Chip Package with Redistribution Structure Having Multiple Chips
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US119488922024
Formation Method of Chip Package with Fan-out Feature
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US118549552023
Fan-out Package with Controllable Standoff
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US118550592023
Fan-out Package with Cavity Substrate
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US118482652023
Semiconductor Package with Improved Interposer Structure
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US118240072023
Dual-sided Routing in 3D Sip Structure
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US117641592023
Package with Fan-out Structures
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US116825992023
Chip Package Structure with Molding Layer and Method for Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites
US116705772023
Chip Package with Redistribution Structure Having Multiple Chips
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US116462562023
Heterogeneous Fan-out Structure and Method of Manufacture
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US116005732023
Structure and Formation Method of Chip Package with Conductive Support Elements to Reduce Warpage
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites
US116005752023
Method for Forming Chip Package Structure
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites