Patents/Inventors

Teakhoon Lee

Hwaseong-siKR8 patents

10 Patents

US123550042025
Semiconductor Chip and Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US122372402025
Semiconductor Package and Method of Manufacturing Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US122180962025
Semiconductor Package and Method of Forming the Same
Samsung Electronics Co., Ltd.
0 cites
US121763132024
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US119675812024
Package Structures Having Underfills
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US119233402024
Semiconductor Package Including Mold Layer and Manufacturing Method Thereof
Samsung Electronics Co., Ltd.
0 cites
US117912822023
Semiconductor Package Including Part of Underfill on Portion of a Molding Material Surrounding Sides of Logic Chip and Memory Stack on Interposer and Method for Manufacturing the Same
Samsung Electronics Co., Ltd.
0 cites
US117913082023
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US117053232023
Wafer Trimming Device
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US115879062023
Package Structures Having Underfills
SAMSUNG ELECTRONICS CO., Ltd.
0 cites