Teak Hoon Lee

8 Patents

• US124009802025

  Semiconductor Package

  Samsung Electronics Co., Ltd.

  0 cites
• US123623282025

  Semiconductor Package and Method of Fabricating the Same

  Samsung Electronics Co., Ltd.

  0 cites
• US121659912024

  Semiconductor Package

  Samsung Electronics Co., Ltd.

  0 cites
• US121130502024

  Semiconductor Package with Increased Thermal Radiation Efficiency

  SAMSUNG ELECTRONICS CO., Ltd.

  0 cites
• US120741412024

  Semiconductor Package

  SAMSUNG ELECTRONICS CO., Ltd.

  0 cites
• US119233432024

  Semiconductor Package and Method of Fabricating the Same

  Samsung Electronics Co., Ltd.

  0 cites
• US118482932023

  Semiconductor Package

  Samsung Electronics Co., Ltd.

  0 cites
• US115944992023

  Semiconductor Package

  Samsung Electronics Co., Ltd.

  0 cites