Patents/Inventors

Teahwa Jeong

Hwaseong-siKR2 patents

3 Patents

US124761802025
Interconnection Structure and Semiconductor Package Including the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US117422712023
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US116370582023
Interconnection Structure and Semiconductor Package Including the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites