3 Patents
- US118814402024Carbon Based Polymer Thermal Interface Materials with Polymer Chain to Carbon Based Fill Particle Bonds
Intel Corporation
0 cites - US118429442023IC Assemblies Including Die Perimeter Frames Suitable for Containing Thermal Interface Materials
Intel Corporation
0 cites - US116768762023Semiconductor Die Package with Warpage Management and Process for Forming Such
Intel Corporation
0 cites