Patents/Inventors

Tatsuya Arisawa

FukushimaJP2 patents

3 Patents

US124477192025
Metal-clad Laminate, Wiring Board, Resin-including Metal Foil, and Resin Composition
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., Ltd.
0 cites
US121097792024
Copper-clad Laminate, Wiring Board, and Copper Foil with Resin
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., Ltd.
0 cites
US118957702024
Copper-clad Laminate, Wiring Board, and Copper Foil Provided with Resin
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., Ltd.
0 cites