3 Patents
- US124514542025Manufacturing Method of Packaging Structure for Bipolar Transistor with Constricted Bumps
FUJI ELECTRIC CO., Ltd.
0 cites - US117054192023Packaging Structure for Bipolar Transistor with Constricted Bumps
FUJI ELECTRIC CO., Ltd.
0 cites - US115454092023Semiconductor Module Having Block Electrode Bonded to Collector Electrode and Manufacturing Method Thereof
FUJI ELECTRIC CO., Ltd.
0 cites