Patents/Inventors

Tatsuhiko Aoki

NiigataJP2 patents

3 Patents

US124889792025
Lamination Wafers and Method of Producing Bonded Wafers Using the Same
GLOBALWAFERS JAPAN CO., Ltd.
0 cites
US123786952025
Method for Heat-treating Silicon Wafer
GLOBALWAFERS JAPAN CO., Ltd.
0 cites
US123718132025
Silicon Wafer and Method for Producing Silicon Wafer
TOHOKU UNIVERSITY
0 cites