Patents/Inventors

Tarek Ibrahim

Mesa, AZUS16 patents

15 Patents

US125735362026
Electronic Substrates Having Embedded Inductors
Intel Corporation
0 cites
US123622502025
Protruding SN Substrate Features for Epoxy Flow Control
Intel Corporation
0 cites
US123344472025
Lithographically Defined Vertical Interconnect Access (VIA) for a Bridge Die First Level Interconnect (FLI)
0 cites
US123361972025
In-plane Inductors in IC Packages
Intel Corporation
0 cites
US123138902025
Through-substrate Optical Vias
Intel Corporation
0 cites
US123006202025
Inorganic-based Embedded-die Layers for Modular Semiconductive Devices
Intel Corporation
0 cites
US122724842025
Coreless Electronic Substrates Having Embedded Inductors
Intel Corporation
0 cites
US120572522024
Electronic Substrates Having Embedded Inductors
Intel Corporation
0 cites
US120339302024
Selectively Roughened Copper Architectures for Low Insertion Loss Conductive Features
Intel Corporation
0 cites
US120274662024
Conductive Route Patterning for Electronic Substrates
Intel Corporation
0 cites
US120092712024
Protruding SN Substrate Features for Epoxy Flow Control
Intel Corporation
0 cites
US117988872023
Inorganic-based Embedded-die Layers for Modular Semiconductive Devices
Intel Corporation
0 cites
US117768642023
Corner Guard for Improved Electroplated First Level Interconnect Bump Height Range
Intel Corporation
0 cites
US117641502023
Inductors for Package Substrates
Intel Corporation
0 cites
US116224482023
Sandwich-molded Cores for High-inductance Architectures
Intel Corporation
0 cites