21 Patents
- 0 cites
- US125557142026Device, Method, and System to Provide Passivation Structures of a Magnetic Material Based Inductor
Intel Corporation
0 cites - 0 cites
- 0 cites
- US125123962025Flexible Die to Floor Planning with Bump Pitch Scale Through Glass Core via Pitch
Intel Corporation
0 cites - 0 cites
- 0 cites
- US124226152025Nested Glass Packaging Architecture for Hybrid Electrical and Optical Communication Devices
Intel Corporation
0 cites - 0 cites
- 0 cites
- US123459322025Die Last and Waveguide Last Architecture for Silicon Photonic Packaging
Intel Corporation
0 cites - US123344532025Soldered Metallic Reservoirs for Enhanced Transient and Steady-state Thermal Performance
Intel Corporation
0 cites - 0 cites
- 0 cites
- 0 cites
- 0 cites
- US121762922024Microelectronic Component Having Molded Regions with Through-mold Vias
Intel Corporation
0 cites - US120681722024Sacrificial Pads to Prevent Galvanic Corrosion of FLI Bumps in EMIB Packages
Intel Corporation
0 cites - 0 cites
- US118173902023Microelectronic Component Having Molded Regions with Through-mold Vias
Intel Corporation
0 cites - US116409422023Microelectronic Component Having Molded Regions with Through-mold Vias
Intel Corporation
0 cites