5 Patents
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- US119293002024Method for Packaging an Integrated Circuit (IC) Package with Embedded Heat Spreader in a Redistribution Layer (RDL)
Qorvo US, Inc.
0 cites - 0 cites
- US116263402023Integrated Circuit (IC) Package with Embedded Heat Spreader in a Redistribution Layer (RDL)
Qorvo US, Inc.
0 cites - 0 cites