Tao-chih Chang

3 Patents

• US118549612023

  Package Substrate and Method of Fabricating the Same and Chip Package Structure

  Unimicron Technology Corp.

  0 cites
• US117768672023

  Chip Package

  Industrial Technology Research Institute

  0 cites
• US117568582023

  Power Module with Housing Having Bending Sections

  DIODES TAIWAN S.A R.L.

  0 cites