Patents/Inventors

Taku Muneda

Tokyo-toJP1 patent

2 Patents

US123375782025
Outer Packing Material for Vacuum Insulation Material, Vacuum Insulation Material, and Article Provided with Vacuum Insulation Material
DAI NIPPON PRINTING CO., Ltd.
0 cites
US116559322023
Outer Packing Material for Vacuum Insulation Material, Vacuum Insulation Material, and Article Provided with Vacuum Insulation Material
DAI NIPPON PRINTING CO., Ltd.
0 cites