Patents/Inventors

Takeshi Nogami

Schenectady, NYUS11 patents

12 Patents

US124827042025
Self-forming Barrier for Use in Air Gap Formation
Adeia Semiconductor Solutions LLC
0 cites
USRE0504942025
Self-forming Embedded Diffusion Barriers
TESSERA LLC
0 cites
US121366552024
Backside Electrical Contacts to Buried Power Rails
International Business Machines Corporation
0 cites
US121069692024
Substrate Thinning for a Backside Power Distribution Network
International Business Machines Corporation
0 cites
US120876852024
Semiconductor Interconnect Structure with Double Conductors
Tessera LLC
0 cites
US120027582024
Backside Metal-insulator-metal (MIM) Capacitors Extending Through Backside Interlayer Dielectric (BILD) Layer or Semiconductor Layer and Partly Through Dielectric Layer
International Business Machines Corporation
0 cites
US119424262024
Semiconductor Structure Having Alternating Selective Metal and Dielectric Layers
International Business Machines Corporation
0 cites
US119159662024
Backside Power Rail Integration
International Business Machines Corporation
0 cites
US119087342024
Composite Interconnect Formation Using Graphene
International Business Machines Corporation
0 cites
US118044052023
Method of Forming Copper Interconnect Structure with Manganese Barrier Layer
Tessera LLC
0 cites
US117496022023
Topological Semi-metal Interconnects
International Business Machines Corporation
0 cites
US115878302023
Self-forming Barrier for Use in Air Gap Formation
TESSERA LLC
0 cites