Takeshi Kitahara

6 Patents

• US123565542025

  Method for Manufacturing Bonded Body and Method for Manufacturing Insulation Circuit Substrate

  MITSUBISHI MATERIALS CORPORATION

  0 cites
• US119087682024

  Method of Manufacturing Bonded Body for Insulation Circuit Substrate Board and Bonded Body for Insulation Circuit Substrate Board

  MITSUBISHI MATERIALS CORPORATION

  0 cites
• US118712752024

  Node Apparatus, Method for Controlling the Same, and Storage Medium

  KDDI CORPORATION

  0 cites
• US117354342023

  Method for Producing Insulating Circuit Substrate with Heat Sink

  MITSUBISHI MATERIALS CORPORATION

  0 cites
• US116768822023

  Method of Manufacturing Power Module Substrate Board and Ceramic-copper Bonded Body

  MITSUBISHI MATERIALS CORPORATION

  0 cites
• US115469212023

  Wireless Communication Apparatus and Server Apparatus

  DENSO CORPORATION

  0 cites