Patents/Inventors

Takeki Shimizu

TokyoJP1 patent

2 Patents

US125046882025
Negative Photosensitive Resin Composition and Method for Manufacturing Cured Relief Pattern
ASAHI KASEI KABUSHIKI KAISHA
0 cites
US121745392024
Negative Photosensitive Resin Composition, Production Method for Polyimide, Production Method for Cured Relief Pattern, and Semiconductor Device
ASAHI KASEI KABUSHIKI KAISHA
0 cites