28 Patents
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- US126000402026Simulation Device Using Three-dimensional Position Information Obtained from Output from Vision Sensor
FANUC CORPORATION
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- US125033872025Seal Structure of Wire Drawing Furnace for Optical Fiber, and Production Method for Optical Fiber
SUMITOMO ELECTRIC INDUSTRIES, Ltd.
0 cites - US123937502025Computer-readable Recording Medium Storing Machine Learning Program, Information Processing Apparatus, and Machine Learning Method
Fujitsu Limited
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- US122556192025Vibration Element, Manufacturing Method of Vibration Element, Physical Quantity Sensor, Inertial Measurement Device, Electronic Apparatus, and Vehicle
SEIKO EPSON CORPORATION
0 cites - US122407292025Wire Body Winding Device and Wire Body Winding Method
SUMITOMO ELECTRIC INDUSTRIES, Ltd.
0 cites - US122089872025Wire Body Winding Device and Wire Body Manufacturing Method
SUMITOMO ELECTRIC INDUSTRIES, Ltd.
0 cites - 0 cites
- US120744032024Connector Receiver Unit Manufacturing Method, Connector Receiver Unit, and Electrical Component
YAMADA MANUFACTURING CO., Ltd.
0 cites - US119809982024Polishing Device, Polishing Method, and Recording Medium for Recording Program for Determining Supply Position of Polishing Liquid
EBARA CORPORATION
0 cites - US118884642024Vibration Element, Physical Quantity Sensor, Inertial Measurement Unit, Electronic Apparatus, and Vehicle
SEIKO EPSON CORPORATION
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- US117846322023Vibrator Device, Manufacturing Method of Vibrator Device, Electronic Device, and Vehicle
Seiko Epson Corporation
0 cites - US117800952023Machine Learning Device, Robot System, and Machine Learning Method for Learning Object Picking Operation
PREFERRED NETWORKS, Inc.
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- US117128082023Machine Learning Device, Robot System, and Machine Learning Method for Learning Object Picking Operation
PREFERRED NETWORKS. Inc.
0 cites - US117104562023Display Apparatus and Electronic Device with Light Emitting Device Drive Circuit Including Transistors with Different Semiconductor Materials
Sony Group Corporation
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- US115950262023Vibration Element, Manufacturing Method of Vibration Element, Physical Quantity Sensor, Inertial Measurement Device, Electronic Apparatus, and Vehicle
SEIKO EPSON CORPORATION
0 cites - US115533232023Computer-readable Recording Medium, Information Processing Method, and Information Processing Device
FUJITSU LIMITED
0 cites - 0 cites