Takashi Ozaki

10 Patents

• US126181492026

  Cleaning Method, Method of Manufacturing Semiconductor Device, Substrate Processing Apparatus, and Recording Medium

  Kokusai Electric Corporation

  0 cites
• US126010592026

  Substrate Processing Apparatus, Method of Manufacturing Semiconductor Device, and Recording Medium

  KOKUSAI ELECTRIC CORPORATION

  0 cites
• US125125002025

  Jig

  TOYOTA JIDOSHA KABUSHIKI KAISHA

  0 cites
• US124244372025

  Processing Method, Method of Manufacturing Semiconductor Device, Processing Apparatus, and Recording Medium

  Kokusai Electric Corporation

  0 cites
• US122116892025

  Method of Manufacturing Semiconductor Device Capable of Controlling Film Thickness Distribution

  KOKUSAI ELECTRIC CORPORATION

  0 cites
• US119786232024

  Method of Manufacturing Semiconductor Device, Substrate Processing Apparatus, and Recording Medium

  KOKUSAI ELECTRIC CORPORATION

  0 cites
• US119617332024

  Method of Manufacturing Semiconductor Device, Substrate Processing Method, Substrate Processing Apparatus, and Recording Medium

  Kokusai Electric Corporation

  0 cites
• US118279792023

  Cleaning Method, Method of Manufacturing Semiconductor Device, Substrate Processing Apparatus, and Recording Medium

  KOKUSAI ELECTRIC CORPORATION

  0 cites
• US117354422023

  Method of Operating Substrate Processing Apparatus, Method of Manufacturing Semiconductor Device, Substrate Processing Apparatus, and Recording Medium

  KOKUSAI ELECTRIC CORPORATION

  0 cites
• US115944122023

  Method of Manufacturing Semiconductor Device, Substrate Processing Apparatus, and Recording Medium

  KOKUSAI ELECTRIC CORPORATION

  0 cites