Patents/Inventors

Takashi Okamura

TokyoJP3 patents

4 Patents

US124244942025
Processing Method of Wafer
DISCO CORPORATION
0 cites
US120976332024
Cutting Method
DISCO CORPORATION
0 cites
US119357382024
Method of Processing a Wafer
DISCO CORPORATION
0 cites
US116266802023
Pin Plunger and IC Socket
Kioxia Corporation
0 cites