Patents/Inventors

Takashi Noma

OtaJP14 patents

13 Patents

US124697092025
Semiconductor Package Electrical Contact Structures and Related Methods
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US124631232025
Multi-chip System-in-package
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US124313592025
Semiconductor Package Electrical Contacts and Related Methods
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US123226322025
Substrate Alignment Systems and Related Methods
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US122610842025
Fan-out Wafer Level Packaging of Semiconductor Devices
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US122305022025
Semiconductor Package Stress Balance Structures and Related Methods
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US121990412025
Thinned Semiconductor Package and Related Methods
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US121548772024
Semiconductor Wafer and Method of Ball Drop on Thin Wafer with Edge Support Ring
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US120402952024
Semiconductor Device with Backmetal and Related Methods
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US117354972023
Integrated Passive Device and Fabrication Method Using a Last Through-substrate Via
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US117284242023
Isolation in a Semiconductor Device
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US116768632023
Structures for Aligning a Semiconductor Wafer for Singulation
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US116462672023
Thinned Semiconductor Package and Related Methods
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites