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Inventors
Takashi Kawamori
Tokyo
JP
8 patents
6 Patents
US12595401
2026
Adhesive Set, Adhesive Body, and Method for Producing Same
0 cites
US12543538
2026
Temporary Fixation Layered Film and Production Method Therefor, Temporary Fixation Layered Body, and Semiconductor Device Production Method
0 cites
US12258498
2025
Adhesive Set, Adhesive Body, and Manufacturing Method Therefor
0 cites
US12165882
2024
Semiconductor Device Manufacturing Method
0 cites
US12084599
2024
Semiconductor Device Manufacturing Method, Curable Resin Composition for Temporary Fixation Material, Film for Temporary Fixation Material, and Laminated Film for Temporary Fixation Material
RESONAC CORPORATION
0 cites
US11840648
2023
Semiconductor Device Manufacturing Method, Curable Resin Composition for Temporary Fixation Material, Film for Temporary Fixation Material, and Laminated Film for Temporary Fixation Material
RESONAC CORPORATION
0 cites