Patents/Inventors

Takashi Hisada

HachioujiJP17 patents

13 Patents

US126222842026
Solder Volume for Flip-chip Bonding
International Business Machines Corporation
0 cites
US124566562025
Multichip Interconnect Package
International Business Machines Corporation
0 cites
US123549832025
Fine-pitch Joining Pad Structure
International Business Machines Corporation
0 cites
US123157752025
Underfill Vacuum Process
INTERNATIONAL BUSINESS MACHINES CORPORATION
0 cites
US121837082024
Double Resist Structure for Electrodeposition Bonding
International Business Machines Corporation
0 cites
US121660082024
Injection Molded Solder Head with Improved Sealing Performance
INTERNATIONAL BUSINESS MACHINES CORPORATION
0 cites
US121426032024
Bonding of Bridge to Multiple Semiconductor Chips
International Business Machines Corporation
0 cites
US120948252024
Interconnection Between Chips by Bridge Chip
International Business Machines Corporation
0 cites
US119698282024
Prevention of Dripping of Material for Material Injection
INTERNATIONAL BUSINESS MACHINES CORPORATION
0 cites
US119087232024
Silicon Handler with Laser-release Layers
INTERNATIONAL BUSINESS MACHINES CORPORATION
0 cites
US118482722023
Interconnection Between Chips by Bridge Chip
International Business Machines Corporation
0 cites
US117355752023
Bonding of Bridge to Multiple Semiconductor Chips
International Business Machines Corporation
0 cites
US116849882023
Prevention of Dripping of Material for Material Injection
INTERNATIONAL BUSINESS MACHINES CORPORATION
0 cites