Patents/Inventors

Takao Tanigawa

TokyoJP2 patents

3 Patents

US123241052025
Maleimide Resin Composition, Prepreg, Resin Film, Laminated Board, Printed Wiring Board, and Semiconductor Package
Resonac Corporation
0 cites
US120246242024
Maleimide Resin Composition, Prepreg, Laminated Board, Resin Film, Printed Wiring Board, and Semiconductor Package
RESONAC CORPORATION
0 cites
US117454822023
Fluororesin Substrate Laminate
RESONAC CORPORATION
0 cites