Patents/Inventors

Takamasa Takano

Tokyo-toJP6 patents

7 Patents

US123946802025
Through Electrode Substrate, Manufacturing Method Thereof and Mounting Substrate
DAI NIPPON PRINTING CO., Ltd.
0 cites
US122551452025
Multi-layer Line Structure
DAI NIPPON PRINTING CO., Ltd.
0 cites
US121365912024
Through Electrode Substrate and Semiconductor Device
DAI NIPPON PRINTING CO., Ltd.
0 cites
US121192932024
Through Electrode Substrate and Mounting Substrate
DAI NIPPON PRINTING CO., Ltd.
0 cites
US118625642024
Multi-layer Line Structure and Method for Manufacturing Thereof
DAI NIPPON PRINTING CO., Ltd.
0 cites
US118108202023
Through Electrode Substrate, Method of Manufacturing Through Electrode Substrate, and Mounting Substrate
DAI NIPPON PRINTING CO., Ltd.
0 cites
US117422732023
Through Electrode Substrate and Semiconductor Device
DAI NIPPON PRINTING CO., Ltd.
0 cites