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Inventors
Takahiro Kuroda
Tokyo
JP
3 patents
4 Patents
US12435248
2025
Temporary Protective Film for Semiconductor Encapsulation Molding, Lead Frame Provided with Temporary Protective Film, Encapsulation Molded Body, and Method for Manufacturing Semiconductor Package
0 cites
US12398298
2025
Temporary Protective Film for Producing Semiconductor Device, Reel Body, and Method for Producing Semiconductor Device
0 cites
US11908762
2024
Temporary Protective Film for Semiconductor Sealing Molding, Lead Frame with Temporary Protective Film, Sealed Molded Body with Temporary Protective Film, and Method for Producing Semiconductor Device
RESONAC CORPORATION
0 cites
US11682564
2023
Temporary Protective Film for Semiconductor Encapsulation Molding, Lead Frame Provided with Temporary Protective Film, Encapsulated Molded Body Provided with Temporary Protective Film, and Method for Manufacturing Semiconductor Device
RESONAC CORPORATION
0 cites