Patents/Inventors

Takahiro Hirano

GotembaJP29 patents

22 Patents

US125833392026
Information Processing Apparatus and Information Processing System
TOYOTA JIDOSHA KABUSHIKI KAISHA
0 cites
US125777032026
Melt Spinning Resin Composition, Manufacturing Method for Same, and Fiber Manufacturing Method
Kao Corporation
0 cites
US125819462026
Semiconductor Device and Power Converter
DENSO CORPORATION
0 cites
US125649982026
Production Method for Personal Care Product
KAO CORPORATION
0 cites
US125339732026
Contactless Charging Device and Contactless Charging Method
TOYOTA JIDOSHA KABUSHIKI KAISHA
0 cites
US125347752026
Method of Cooling Control for Steel Plate, Cooling Control Device, and Method of Manufacturing Steel Plate
JFE STEEL CORPORATION
0 cites
US124345782025
Power Feed Mat
TOYOTA JIDOSHA KABUSHIKI KAISHA
0 cites
US124245032025
Semiconductor Device
DENSO CORPORATION
0 cites
US123158252025
Semiconductor Device Having Wire Pieces in Bonding Member
DENSO CORPORATION
0 cites
US122911132025
Vehicle Allocation Apparatus and Vehicle Allocation Method
TOYOTA JIDOSHA KABUSHIKI KAISHA
0 cites
US122649252025
Route Determination Device and Vehicle Dispatch System
TOYOTA JIDOSHA KABUSHIKI KAISHA
0 cites
US122087542025
In-vehicle Network System
TOYOTA JIDOSHA KABUSHIKI KAISHA
0 cites
US121352202024
Power Transmission Device, Non-contact Power Transmission System, and Method for Controlling Power Transmission Device
TOYOTA JIDOSHA KABUSHIKI KAISHA
0 cites
US119017402024
Management System and Method of Managing Power Feed Mat
TOYOTA JIDOSHA KABUSHIKI KAISHA
0 cites
US118311812023
Power Feed System for Evaluating Placement Benefits of Power Feed Mat
TOYOTA JIDOSHA KABUSHIKI KAISHA
0 cites
US117422562023
Semiconductor Device
DENSO CORPORATION
0 cites
US117220122023
Power Feed System and Power Feed Method
TOYOTA JIDOSHA KABUSHIKI KAISHA
0 cites
US116712842023
Vehicle Onboard Network System
TOYOTA JIDOSHA KABUSHIKI KAISHA
0 cites
US116391442023
In-vehicle Network System
TOYOTA JIDOSHA KABUSHIKI KAISHA
0 cites
US116222502023
In-vehicle Network System
MAZDA MOTOR CORPORATION
0 cites
US115713812023
Composition for Forming Coating
KAO CORPORATION
0 cites
US115454192023
Semiconductor Package Having an Additional Material with a Comparative Tracking Index (CTI) Higher Than That of Encapsulant Resin Material Formed Between Two Terminals
DENSO CORPORATION
0 cites