Takahiko Mitsui

6 Patents

• US123580952025

  Substrate Grinding Device and Substrate Grinding Method

  OKAMOTO MACHINE TOOL WORKS, Ltd.

  0 cites
• US120681652024

  Method for Manufacturing Semiconductor Device and Apparatus for Manufacturing Semiconductor Device

  OKAMOTO MACHINE TOOL WORKS, Ltd.

  0 cites
• US119809972024

  Dressing Apparatus and Polishing Apparatus

  OKAMOTO MACHINE TOOL WORKS, Ltd.

  0 cites
• US117452992023

  Grinding Method of Composite Substrate Including Resin and Grinding Apparatus Thereof

  OKAMOTO MACHINE TOOL WORKS, Ltd.

  0 cites
• US117421702023

  Fuse Puller Accommodating Structure and an Electrical Junction Box

  YAZAKI CORPORATION

  0 cites
• US117354112023

  Method and Apparatus for Manufacturing Semiconductor Device

  OKAMOTO MACHINE TOOL WORKS, Ltd.

  0 cites