12 Patents
- US125937142026Semiconductor Device Including Bonding Enhancement Layer and Method of Forming the Same
Samsung Electronics Co., Ltd.
0 cites - US125787622026Electronic Device Including Sliding Structure and Flexible Display with Audio Data Adjustment
Samsung Electronics Co., Ltd.
0 cites - US124951112025Electronic Device Including Plurality of Displays and Method of Operating Same
Samsung Electronics Co., Ltd.
0 cites - 0 cites
- US122242622025Substrate Bonding Apparatus and Method of Manufacturing Semiconductor Device by Using the Same
Samsung Electronics Co., Ltd.
0 cites - 0 cites
- US120863932024Communication Method and Device Using Avatar in Virtual Space
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - US119904442024Substrate Bonding Apparatus and Method of Manufacturing Semiconductor Device by Using the Same
Samsung Electronics Co., Ltd.
0 cites - US119228422024Electronic Device Having Extendable Display and Method for Providing Content Thereof
Samsung Electronics Co., Ltd.
0 cites - US117281972023Wafer to Wafer Bonding Apparatus and Wafer to Wafer Bonding Method
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - 0 cites
- US115944432023Substrate Bonding Apparatus and Method of Manufacturing Semiconductor Device by Using the Substrate Bonding Apparatus
Samsung Electronics Co., Ltd.
0 cites