Patents/Inventors

Taewon Yoo

SeoulKR8 patents

8 Patents

US125937372026
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US123622532025
Semiconductor Package and Method of Fabricating the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US123278242025
Semiconductor Package Including Redistribution Substrate
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US121912362025
Semiconductor Package
Samsung Electronics Co., Ltd.
0 cites
US121548892024
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US120093282024
Semiconductor Package and Method of Manufacturing the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US117054182023
Semiconductor Package with Conductive Bump on Conductive Post Including an Intermetallic Compound Layer
Samsung Electronics Co., Ltd.
0 cites
US116768752023
Semiconductor Package Including Non-conductive Film Between Package Substrate and Semiconductor Chip Thereon
Samsung Electronics Co., Ltd.
0 cites