Patents/Inventors

Taesung Jeong

Suwon-siKR6 patents

6 Patents

US125754182026
Semiconductor Packages Having Organic Material Layer Between Through-via Structure and Encapsulant That Surrounds a Portion of Semiconductor Chip
Samsung Electronics Co., Ltd.
0 cites
US124531072025
Semiconductor Device and Semiconductor Package Including the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US123344452025
Method of Fabricating a Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US122180992025
Interposer and Semiconductor Package Including the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US117841292023
Semiconductor Package and Method of Fabricating the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US116769152023
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites