Taekeun Lee

6 Patents

• US124245952025

  Semiconductor Device and Method of Forming Package with Double-sided Integrated Passive Device

  STATS Chippac Pte. Ltd.

  0 cites
• US121257642024

  Semiconductor Device and Method of Forming Hybrid TIM Layers

  STATS Chippac Pte. Ltd.

  0 cites
• US120271252024

  Display Device

  LG DISPLAY CO., Ltd.

  0 cites
• US119293342024

  Die-beam Alignment for Laser-assisted Bonding

  STATS Chippac Pte. Ltd.

  0 cites
• US118307852023

  Package with Windowed Heat Spreader

  STATS Chippac Pte. Ltd.

  0 cites
• US117354892023

  Semiconductor Device and Method of Forming Hybrid TIM Layers

  STATS Chippac Pte. Ltd.

  0 cites