Patents/Inventors

Taejun Jeon

Suwon-siKR6 patents

5 Patents

US125507392026
Semiconductor Package Including a Metal Plate and Package-on-package Having the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US124631262025
Semiconductor Package
Samsung Electronics Co., Ltd.
0 cites
US124009702025
Semiconductor Package Including Electromagnetic Shield Structure
Samsung Electronics Co., Ltd.
0 cites
US123082532025
Molded Product for Semiconductor Strip and Method of Manufacturing Semiconductor Package
Samsung Electronics Co., Ltd.
0 cites
US122059252025
Semiconductor Package Having Package Substrate
SAMSUNG ELECTRONICS CO., Ltd.
0 cites