Tae-young Lee

3 Patents

• US125688232026

  Semiconductor Package Structure

  Samsung Electronics Co., Ltd.

  0 cites
• US118151272023

  Welded Member for Plated Steel Plate Excellent in Weld Zone Porosity Resistance and Fatigue Properties and Method for Manufacturing the Same

  POSCO CO., Ltd

  0 cites
• US117913212023

  Method of Fabricating Semiconductor Package and Semiconductor Package

  Samsung Electronics Co., Ltd.

  0 cites