8 Patents
- US125529622026CMP Slurry Composition for Polishing Tungsten Pattern Wafer and Method of Polishing Tungsten Pattern Wafer Using the Same
SAMSUNG SDI CO., Ltd.
0 cites - US124604052025Method for Horizontal Leveling Coupling Between Concrete Foundation and Wooden Vertical Beams
INDUSTRY-ACADEMIC COOPERATION FOUNDATION, DANKOOK UNIVERSITY
0 cites - 0 cites
- US121396422024CMP Slurry Composition for Polishing Tungsten Pattern Wafer and Method of Polishing Tungsten Pattern Wafer Using the Same
SAMSUNG SDI CO., Ltd.
0 cites - US120175972024Control Device and Method for Controlling Passenger Protection Device
Hyundai Mobis Co., Ltd.
0 cites - 0 cites
- US115604952023CMP Slurry Composition for Polishing Tungsten Pattern Wafer and Method of Polishing Tungsten Pattern Wafer Using the Same
SAMSUNG SDI CO., Ltd.
0 cites - 0 cites