Tae Kyung Won

8 Patents

• US123945952025

  Multi-antenna Unit for Large Area Inductively Coupled Plasma Processing Apparatus

  Applied Materials, Inc.

  0 cites
• US123621492025

  Film Stress Control for Plasma Enhanced Chemical Vapor Deposition

  Applied Materials, Inc.

  0 cites
• US122374062025

  Plasma Treatment on Metal-oxide TFT

  Applied Materials, Inc.

  0 cites
• US120767632024

  Selective In-situ Cleaning of High-k Films from Processing Chamber Using Reactive Gas Precursor

  Applied Materials, Inc.

  0 cites
• US119675162024

  Substrate Support for Chucking of Mask for Deposition Processes

  Applied Materials, Inc.

  0 cites
• US119292362024

  Methods of Tuning to Improve Plasma Stability

  APPLIED MATERIALS, Inc.

  0 cites
• US118547712023

  Film Stress Control for Plasma Enhanced Chemical Vapor Deposition

  APPLIED MATERIALS, Inc.

  0 cites
• US117709642023

  Thin-film Encapsulation

  Applied Materials, Inc.

  0 cites