6 Patents
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- US123099242025Connection Structure Embedded Substrate and Substrate Structure Including the Same
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites - US122624672025Printed Circuit Board Including an Insulating Layer and a Metal Post
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
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- US117372112023Connection Structure Embedded Substrate and Substrate Structure Including the Same
Samsung Electro-mechanics Co., Ltd.
0 cites